At present, from a global perspective, new technologies and new products in the flat panel display industry are constantly emerging. However, there is still a certain gap between the flat panel display enterprises in China and the international advanced level in terms of production scale, technological innovation and industrial support.
The Ministry of Industry and Information Technology and the National Development and Reform Commission promoted the “Three-Year Action†plan for China's new display industry, and promoted enterprises to accelerate the mastery of LTPS and Oxide backplane production technology, and promote the development of TFT-LCD in high-resolution, low-power, narrow-frame, etc. Structural Adjustment. Break through the key process technologies such as AMOLED backplane, evaporation and packaging, realize new applications such as AMOLED panel mass production and flexible display, strengthen forward-looking technology research, layout holographic, laser and other display technologies as well as new display materials such as carbon-based and quantum dots.
Under the guidance of the Electronic Information Department of the Ministry of Industry and Information Technology, the 3rd China Electronic Information Expo (CITE2015) and the 2015 China (International) Touch Screen Industry Development Summit Forum hosted by the Shenzhen Flat Panel Display Industry Association will be held on April 9th, 2015. On the 11th, it was held at the Shenzhen International Convention and Exhibition Center.
At that time, Dr. Xiao Guowei, President of Jingke Electronics, will share with you the successful technology and experience of Jingke in the field of LED backlight and mobile flash lighting. Welcome to attend! At the same time, Jingke will release the latest backlight and flash products at the exhibition site (Booth No. 1E015) .
It is understood that Jingke Electronics uses white light chip technology: wafer level process, no gold wire packaging process, LED chip coated with phosphor powder, directly soldered to the circuit substrate by SMT method, and introduced high reliability side light emission The backlight package device 4014, 7020 is a direct type backlight device 3030. Among them, 3030, can optimize the chip and improve the heat dissipation channel, the pulse current is increased from 400mA to 600mA. The 7020 optimizes the chip and improves the thermal path. The pulse current is increased from 120mA to 160mA. 4014, optimized chip and bracket material, pulse current is increased from 120mA to 150mA.
At present, Jingke Electronics is mainly engaged in large-size backlight, and its products have successfully entered the supply chain of mainstream TV manufacturers such as TCL, Skyworth, Hisense and Changhong. (This article is the electronic submission of Jingke)
For more information about Jingke, please visit
The Ministry of Industry and Information Technology and the National Development and Reform Commission promoted the “Three-Year Action†plan for China's new display industry, and promoted enterprises to accelerate the mastery of LTPS and Oxide backplane production technology, and promote the development of TFT-LCD in high-resolution, low-power, narrow-frame, etc. Structural Adjustment. Break through the key process technologies such as AMOLED backplane, evaporation and packaging, realize new applications such as AMOLED panel mass production and flexible display, strengthen forward-looking technology research, layout holographic, laser and other display technologies as well as new display materials such as carbon-based and quantum dots.
Under the guidance of the Electronic Information Department of the Ministry of Industry and Information Technology, the 3rd China Electronic Information Expo (CITE2015) and the 2015 China (International) Touch Screen Industry Development Summit Forum hosted by the Shenzhen Flat Panel Display Industry Association will be held on April 9th, 2015. On the 11th, it was held at the Shenzhen International Convention and Exhibition Center.
At that time, Dr. Xiao Guowei, President of Jingke Electronics, will share with you the successful technology and experience of Jingke in the field of LED backlight and mobile flash lighting. Welcome to attend! At the same time, Jingke will release the latest backlight and flash products at the exhibition site (Booth No. 1E015) .
It is understood that Jingke Electronics uses white light chip technology: wafer level process, no gold wire packaging process, LED chip coated with phosphor powder, directly soldered to the circuit substrate by SMT method, and introduced high reliability side light emission The backlight package device 4014, 7020 is a direct type backlight device 3030. Among them, 3030, can optimize the chip and improve the heat dissipation channel, the pulse current is increased from 400mA to 600mA. The 7020 optimizes the chip and improves the thermal path. The pulse current is increased from 120mA to 160mA. 4014, optimized chip and bracket material, pulse current is increased from 120mA to 150mA.
At present, Jingke Electronics is mainly engaged in large-size backlight, and its products have successfully entered the supply chain of mainstream TV manufacturers such as TCL, Skyworth, Hisense and Changhong. (This article is the electronic submission of Jingke)
For more information about Jingke, please visit
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