According to the latest report of the 1Q17 Micro LED next generation display technology market member report, the key technology development direction of Micro LED covers four major aspects, including epitaxial and chip technology, transfer technology, bonding technology (Bonding), colorization scheme and so on.
Transfer technologyTaking physical grabbing as an example, LuxVue takes the form of electrostatic adsorption of tiny components. The chemical grabbing is represented by X-Celeprint, using the Elastomer Stamp as a medium, and using Van der Waals force for grabbing. In addition, there are many vendors that develop a variety of crawling methods.
Another core technology for film transfer is how to select the micron-level film epitaxy that you want to capture. For example, most of the size of the grabbing force is used to control the target to be selected, such as the aforementioned electrostatic force. Or Van der Waals, and choose different levels of energy for the target you want to capture. In addition, SONY also uses laser cautery to select specific target targets.
Finally, it is generally used to connect the internal circuit of the LED chip with the substrate and the circuit to conduct before the package. However, since the chip of the Micro LED is too small, there is no way to use the general metal wire bonding method to bond with the substrate, so other methods are needed to assemble the substrate. Therefore, the future development of technology is focused on what materials to use for bonding and transfer.
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