LEDC MH reports: During this NEPCON period, Henkel Group, which is known for its leading expertise in the entire electronics manufacturing industry, exhibited a number of products, including LED lighting solutions. The demand for high-brightness LEDs is increasing, and the manufacturing process requirements are more efficient, driving the rapid development of the lighting market. The packaging of LED chips is inseparable from the support and cooperation of professional LED assembly and protection solution providers.
Through the integration of the industry's top brands such as Ablestik ® , Emerson & Cuming ® , Acheson ® , Hysol ® , Loctite ® , Multicore ® , Henkel is able to offer a wide range of products and technologies for LED lighting assembly and protection to meet increasingly demanding market requirements. . Henkel's product line in the lighting market includes LED potting materials, chip bonding, and PCB protection and heat dissipation materials.
Chip bonding is divided into conductive adhesive (84-1ATM, etc.), non-conductive adhesive (DX-10CTM, etc.) and thermal conductive adhesive (QMI536HTTM, etc.); potting adhesive is classified according to the form of package, with Lamp LED filling Sealing (such as 2017M4TM, E1847TM), SMD LED potting (MX17TM, NX76TM) and COB (OT0149-3TM). These two materials are the most basic packaging materials and finally assembly materials, glued at the thermal interface, as well as Henkel's corresponding products in the process of conformal coating and PCB encapsulation. Especially in the packaging process of high-power LED, from dispensing, spot flux, placing light source, hot rod welding, testing to oven curing glue, the viscosity, curing condition, working life and service life of the material, conductive / Thermal conductivity has its own requirements.
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