The chip-on-chip has obvious advantages in lighting applications, with higher cost performance (lumen/yuan), higher reliability, greater illumination angle, higher luminous density, lower system cost, shorter manufacturing process and convenient scale. Production
The flip-chip COB module will be mainly used in high-power products, with higher reliability, thermal resistance and junction temperature 30% lower than the packaged chip.
It is worth mentioning that the production line of flip chip cob can be reduced by 50%. Because there is no gold wire, no bracket, the cost of bom is reduced by more than 20%, and the personnel can be reduced by 30%, which greatly increases the price/performance ratio.
Flip chip cob light source will become the main light source configuration of bulb, downlight, spotlight, mining lamp, etc.; lamp strip, fluorescent tube, flat panel light source is still the world of smd, smd is developing to smaller size; csp package Large-scale entry into backlights and flash applications; chip packaging costs are further reduced, high-voltage small currents simplify the heatsink, and linear ic simplifies power supplies; future light sources will focus on light quality and optimize spectral direction.
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