TE Connectivity (TE) today announced the introduction of a new ultra-large array (XLA) socket technology that delivers more reliable performance with 78% higher warpage control than traditional socket technology. As a result, TE is able to design ultra-large sockets with this unique technology to support high-speed data transmission in next-generation data centers.
Compared to plastic materials, the use of printed circuit board (PCB) substrates minimizes warpage and successfully produces the industry's largest all-in-one socket. It measures up to 110mm x 110mm and has over 10,000 position counting functions. Due to their large capacity, these sockets can achieve extremely high data rates of up to 56 Gbps.
Erin Byrne, vice president and chief technology officer of TE Connectivity's Data and End Devices division, said: "TE's new XLA socket technology can scale to extremely high pin counts, ahead of the market for next-generation switches and servers to meet the future. The scale expansion and performance requirements required for high performance computing and processing power."
XLA socket technology increases the positive position of solder balls and terminals by 33%. The low coefficient of thermal expansion (CTE) helps to make accurate contact with the PCB and reduces the potential SMT risk of customers using this technology. The technology is available in two packages, a hybrid planar grid array package/ball grid array package (LGA/BGA) and a double-sided compression LGA/LGA.
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