On August 17th, the LED industry chain procurement matchmaking conference-materials and equipment held in conjunction with the 2012 Gaogong LED Exhibition was successfully held in the afternoon of the opening day of the exhibition. Exhibitors from the middle and upper reaches of the LED industry chain presented their new products and the characteristics and applications of the main products in the market, effectively promoting the centralized face-to-face technical exchange and procurement between exhibitors and buyers. Docking.
For the heat dissipation technology, Li Lei, the general manager of Zibo Yinhe High-tech Development Co., Ltd., has its own unique insights. Li Lei analyzed the influence of thermal resistance of high-power LED packaging system on LED performance, and systematically expounded the structural characteristics of metal core printed circuit board materials, metal-based insulating board materials, metal matrix composite materials, ceramic copper-clad materials (DBC) and so on. Thermal conductivity.
He believes that traditional packaging materials have certain limitations, and composite materials have excellent comprehensive performance, which can meet the requirements of high-power LEDs for heat dissipation. It is the focus of future research on packaging materials, especially ceramic-based composite materials (DBC). It has a broader application prospect, and he also pointed out that optimizing the preparation process and reducing the production cost are the problems that need to be solved.
For the heat dissipation technology, Li Lei, the general manager of Zibo Yinhe High-tech Development Co., Ltd., has its own unique insights. Li Lei analyzed the influence of thermal resistance of high-power LED packaging system on LED performance, and systematically expounded the structural characteristics of metal core printed circuit board materials, metal-based insulating board materials, metal matrix composite materials, ceramic copper-clad materials (DBC) and so on. Thermal conductivity.
He believes that traditional packaging materials have certain limitations, and composite materials have excellent comprehensive performance, which can meet the requirements of high-power LEDs for heat dissipation. It is the focus of future research on packaging materials, especially ceramic-based composite materials (DBC). It has a broader application prospect, and he also pointed out that optimizing the preparation process and reducing the production cost are the problems that need to be solved.
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