Benefiting from the rapid expansion of the downstream application market, the LED industry has gradually recovered from the second quarter of this year, from lighting applications, as well as strong demand for backlights such as mobile phones, tablet PCs, and large-size TVs, driving the LED packaging industry in production scale and A new round of innovation in manufacturing processes.
From the point of view of market application, the current LED packaging products with larger usage are still based on SMD chip type. Due to the influence of cost performance factors, the use of small and medium power products is also more, and the package types are not changed much, but the specifications and models Slowly shrink and develop on the track of the standard. Especially for the development of the more popular lighting applications, Zhou Feng, executive deputy general manager of Jiangsu Wenrun Optoelectronics Co., Ltd. pointed out that the cost of LED light source accounts for 30-40% of the total lighting. The market is sensitive to price factors, and the market competition and cost. Under the influence of the consideration, the LED package is gradually expanding from the original low power to the medium and high power. The commonly used 0.06W began to shift to 0.2W or 0.5W or even higher. The luminous flux of a single source has been improved from the original 8 lumens to the present. 23 lumens, 55 lumens and even higher.
In terms of product supply, some manufacturers said that after the rapid reduction of LED packaging prices in the last two years, in addition to the rapid price reduction in the lighting market, the price reduction of packaged products will slow down in the coming period, and the market will basically remain stable. One of the topics facing all packaging companies is how to meet the needs of efficient, cost-effective? It requires a smaller LED package size, better light quality, and better heat dissipation, and a single LED must be able to operate at higher wattages. Under this trend, optimizing packaging technology and manufacturing processes, improving luminous efficiency, and reducing the production cost of LED packaging have undoubtedly become the main direction of current industry development.
COB package officially enters the practical stage
For the backlight and lighting two LED market-driven engines, there is a common point in the demand for LED packaging - the continuous improvement of light efficiency, and the best product cost performance; also have their own different requirements. Chen Haiying, director of application development at Jingke Electronics (Guangzhou) Co., Ltd., analyzed that the demand for LED packaging in the backlight market is also increasingly demanding the luminous intensity of individual devices, which leads to an increasing input power of a single packaged device. Large, the luminous flux is also getting larger and larger, which is the need for backlights to reduce costs from the whole machine solution. To this end, the LED device needs to improve the heat resistance of the material, meet the reliability guarantee under high power input, and improve the chip's ability to withstand large current surges, and meet the price conditions of the single high light output performance.
“In addition to the luminous efficacy requirements per dollar of lumens (lm/$), LED lighting is increasingly demanding in terms of light quality. Light quality is manifested in two ways, one is the color of light, the color reproduction, and the daylight spectrum. The degree of similarity, etc.; in addition, the need for secondary light distribution of lamps, to meet the requirements of luminaires for glare, spot, illumination, uniformity, etc. The demand for spectral quality has promoted the advancement of color quality of packaging materials and packaging processes. The demand for light distribution has further promoted the penetration of COB in the form of lighting, especially the COB package further compresses the manufacturing process between the chip and the light engine, thus increasing the cost performance of the product. Chen Haiying said.
At the same time, the demand for high wattage of LED lighting terminal products is also a relatively obvious trend. Jin Haitao, director of the product development management division of Yiguang Electronics Industry Co., Ltd. pointed out that due to the increasing demand for high wattage and light quality, the COB package type is now gradually occupying the mainstream position in the application of the entire lighting market. Especially in the ceiling, downlight and spotlight sections, COB has the advantage of a single light source for directional light source products, and can achieve high wattage or high voltage, so it can meet the design requirements of energy-efficient, single light source. And the effect is more able to highlight the similarity with traditional light sources.
In the actual development of the product, at this stage, Everlight Electronics has gradually changed from the general medium and low power components to the COB form in the lighting package. The existing 3~25WCOB series can not only be directly locked on the heat dissipation module, thereby saving the SMT step. It also provides more heat dissipation space through features such as large light-emitting area, low resistance and low current density, which makes it easier to assemble on the luminaire and create a lower cost structure. According to reports, Yiguang Electronics' COB series have passed the LM80 test to demonstrate its durability and high efficiency performance. In the future, in product planning, Yiguang Electronics will further focus on emphasizing high energy efficiency, high pressure, high color rendering and high cost performance. The same direction.
Jingke Electronics is based on the flip-chip technology-free gold-plated technology platform as the core research and development direction. This year, the company launched a "chip-level LED lighting overall solution", which is in the LED chip manufacturing process, through the new chip-level The process, complete part of the traditional packaging process or save the traditional packaging process, so that the final package size of the LED is reduced, and the performance is more stable. Its "easy series" and flip-chip ceramic-based COB products (FCOB) adopt APT flip-chip soldering patent technology to realize gold-free and solid-free plastic package of single-chip and multi-chip modules, with high brightness and high light efficiency. High reliability, low thermal resistance, good color consistency and other characteristics. At present, Jingke Electronics has invested more in high-power and medium-power, with high-power capacity of about 10 KK/month; medium-power capacity of about 80 KK/month, and the end of the year is to expand to 100 KK/month, mainly for large-size TVs. Machine backlight and LED lighting market.
Packaging materials emphasize processing performance and high light transmission
In general, around the latest development of LED packaging technology, the following three aspects are generally proposed for packaging materials: good processing performance, ensuring higher production efficiency; assisting LED products to improve light efficiency; must be very stable and reliable. Taking the traditional plastic packaging material for LED packaging as an example, Wu Rui, application development and technical support manager of the Asia-Pacific region of the lighting industry of DSM Engineering Plastics Business Department, introduced the increasing reflectivity of materials in more and more customers. Increasingly stringent requirements are imposed on maintaining performance, and while these performances are being improved, costs must also be reduced. “For the cost of injection molding products, in addition to the material itself, the production cost is also very important. With the multi-cavity injection molding, it has become one of the mainstream choices of current processing plants, which also has the flowability and ease of processing performance materials. Processing performance puts higher requirements."
For this application, DSM has long been committed to the development of high thermal conductivity polymers for use in heat sinks and LED bulb housings, high reflection and yellowing resistant materials for optical components, and SMT resistant and yellowing resistant materials for LED modules. Group connectors and other aspects. For example, the company developed Stanyl For Tii LX, which is based on the latest PA4T substrate, has high temperature resistance (satisfying SMT process), high reflection and high mechanical strength. Compared with other types of materials, it has high initial reflectivity. And after reflow soldering, the reflectivity is better, which helps to improve the luminous efficiency of the LED light source; has better injection molding processing performance, can meet higher production efficiency and smaller product design requirements; has good resistance UV ability; less water absorption, excellent adhesion to silicone or epoxy sealant, can ensure long life of LED chips.
According to reports, DSM currently has a localized production plant in Jiangyin, Jiangsu. In order to enhance its R&D capabilities in Asia, the company also established a technology center in Shanghai in 2011 to provide localized innovation and quantity for Chinese customers. Customized technology application. In addition, CAE (Computer Aided Engineering) team in DSM Asia Pacific can provide LED manufacturers with CAE analysis including pre-machine/thermal stress/product flow, mid-term optical/mechanical/reflow soldering test, and late product potential failure. Analytical and other comprehensive technical service projects.
On the other hand, in the development of silicone, an important accessory for LED packaging, with the industry's higher pursuit of LED brightness, silicone materials with higher dismantling rates are also the first choice of manufacturers. Compared with methyl silicone (refractive index of 1.41), phenyl silicone has a relatively high refractive index (up to 1.54) and is receiving increasing attention from the market.
“Although the refractive indices of the two are only 0.12 apart, this small difference has a significant impact on the light output of the LED,†said Maruyama, Director of Global Industry, DOW CORNING Lighting Solutions, “even if it is identical. The chip, light box and input power, the LED potting material made of phenyl silicone has a light output rate that is 7% higher than that of the methyl silicone potting material. Before this, it would take a huge amount of time to significantly improve the performance of the LED chip. Investment; therefore, phenyl silicone potting materials offer a cost-competitive and simple alternative that significantly improves the LED's light output, luminous efficiency and value."
Phenyl silicone packaging materials also have the advantage of better thermal stability, making them widely used in many high-power general-purpose lighting products with 5~50W LED chip-on-board package structures. Compared to methyl-based technology, phenyl silicone packaging materials generally have stronger gas barrier properties, preventing the silver electrode from blackening due to moisture and corrosion. Since these electrodes also have a dual function as a light-reflecting element of the LED, improved gas barrier properties can better maintain the light output performance and reliability of the LED.
New manufacturing processes promote vertical integration of the industry
As a mid-stream of the industry chain, LED packaging is in a critical period of technological renewal. From a technical point of view, if traditional structures/processes continue to be used, the cost-effectiveness of the materials selected will be higher, so it is foreseeable that New packaging technologies, materials, manufacturing processes or both, will appear on the market. For example, recently there are unpackaged LED products introduced by Taiwanese manufacturers. It is understood that the new technology developed by combining the chip process and packaging process with the manufacture of light engines has the characteristics of better heat dissipation of flip-chips. In addition, it has the advantage of low cost. However, some manufacturers said that the technology is still in the evaluation stage. The main difficulty is that the coating of fluorescent materials can not be effectively controlled. Therefore, it is difficult to ensure the stability of light efficiency and light quality. It takes a while for mass production and use.
"LED packaging will develop toward high luminous efficiency, high reliability, high heat dissipation and thinning," Zhou Feng said. "The continuous development of chip technology makes the luminous efficiency of packaged products higher and higher, and new packaging technology. The packaging process will be widely used, such as eutectic technology, flip-chip process, new phosphor coating process, etc., while improving product process high reliability and high heat dissipation, it will further improve product luminous efficiency; high temperature resistance and resistance Materials such as UV and low water absorption, environmentally resistant, thermosetting materials such as EMC, thermoplastic PCT, modified PPA, and ceramic-like plastics will also be used in large quantities; the market will pay more attention to the light quality and low quality of packaged products. Cost, and the quality standards of LED products will continue to be improved and unified."
More importantly, along with the innovation of LED packaging technology and manufacturing process, the position of the packaging chain in the entire industrial chain will be promoted to the vertical direction. In this regard, Chen Haiying said that all technological advances will eventually meet the actual application needs of the market. Under the pressure of increasing the luminous efficiency per dollar (lm/$), the package of single-stand devices is required to be smaller. The highest luminous flux output is possible at the lowest cost. This requires LED packaging technology to learn more from the mature experience of IC packaging, such as EMC, SMC materials, etc. In this process, the industry division of labor will be constantly adjusted due to technological advancement, pure packaging will become more and more in the industry. It is difficult to exist as an independent industrial link, and new technological development will promote the integration of the industry in the vertical direction.
(This article is reproduced on the Internet. The texts and opinions expressed in this article have not been confirmed by this site, nor do they represent the position of Gaogong LED. Readers need to verify the relevant content by themselves.)
From the point of view of market application, the current LED packaging products with larger usage are still based on SMD chip type. Due to the influence of cost performance factors, the use of small and medium power products is also more, and the package types are not changed much, but the specifications and models Slowly shrink and develop on the track of the standard. Especially for the development of the more popular lighting applications, Zhou Feng, executive deputy general manager of Jiangsu Wenrun Optoelectronics Co., Ltd. pointed out that the cost of LED light source accounts for 30-40% of the total lighting. The market is sensitive to price factors, and the market competition and cost. Under the influence of the consideration, the LED package is gradually expanding from the original low power to the medium and high power. The commonly used 0.06W began to shift to 0.2W or 0.5W or even higher. The luminous flux of a single source has been improved from the original 8 lumens to the present. 23 lumens, 55 lumens and even higher.
In terms of product supply, some manufacturers said that after the rapid reduction of LED packaging prices in the last two years, in addition to the rapid price reduction in the lighting market, the price reduction of packaged products will slow down in the coming period, and the market will basically remain stable. One of the topics facing all packaging companies is how to meet the needs of efficient, cost-effective? It requires a smaller LED package size, better light quality, and better heat dissipation, and a single LED must be able to operate at higher wattages. Under this trend, optimizing packaging technology and manufacturing processes, improving luminous efficiency, and reducing the production cost of LED packaging have undoubtedly become the main direction of current industry development.
COB package officially enters the practical stage
For the backlight and lighting two LED market-driven engines, there is a common point in the demand for LED packaging - the continuous improvement of light efficiency, and the best product cost performance; also have their own different requirements. Chen Haiying, director of application development at Jingke Electronics (Guangzhou) Co., Ltd., analyzed that the demand for LED packaging in the backlight market is also increasingly demanding the luminous intensity of individual devices, which leads to an increasing input power of a single packaged device. Large, the luminous flux is also getting larger and larger, which is the need for backlights to reduce costs from the whole machine solution. To this end, the LED device needs to improve the heat resistance of the material, meet the reliability guarantee under high power input, and improve the chip's ability to withstand large current surges, and meet the price conditions of the single high light output performance.
“In addition to the luminous efficacy requirements per dollar of lumens (lm/$), LED lighting is increasingly demanding in terms of light quality. Light quality is manifested in two ways, one is the color of light, the color reproduction, and the daylight spectrum. The degree of similarity, etc.; in addition, the need for secondary light distribution of lamps, to meet the requirements of luminaires for glare, spot, illumination, uniformity, etc. The demand for spectral quality has promoted the advancement of color quality of packaging materials and packaging processes. The demand for light distribution has further promoted the penetration of COB in the form of lighting, especially the COB package further compresses the manufacturing process between the chip and the light engine, thus increasing the cost performance of the product. Chen Haiying said.
At the same time, the demand for high wattage of LED lighting terminal products is also a relatively obvious trend. Jin Haitao, director of the product development management division of Yiguang Electronics Industry Co., Ltd. pointed out that due to the increasing demand for high wattage and light quality, the COB package type is now gradually occupying the mainstream position in the application of the entire lighting market. Especially in the ceiling, downlight and spotlight sections, COB has the advantage of a single light source for directional light source products, and can achieve high wattage or high voltage, so it can meet the design requirements of energy-efficient, single light source. And the effect is more able to highlight the similarity with traditional light sources.
In the actual development of the product, at this stage, Everlight Electronics has gradually changed from the general medium and low power components to the COB form in the lighting package. The existing 3~25WCOB series can not only be directly locked on the heat dissipation module, thereby saving the SMT step. It also provides more heat dissipation space through features such as large light-emitting area, low resistance and low current density, which makes it easier to assemble on the luminaire and create a lower cost structure. According to reports, Yiguang Electronics' COB series have passed the LM80 test to demonstrate its durability and high efficiency performance. In the future, in product planning, Yiguang Electronics will further focus on emphasizing high energy efficiency, high pressure, high color rendering and high cost performance. The same direction.
Jingke Electronics is based on the flip-chip technology-free gold-plated technology platform as the core research and development direction. This year, the company launched a "chip-level LED lighting overall solution", which is in the LED chip manufacturing process, through the new chip-level The process, complete part of the traditional packaging process or save the traditional packaging process, so that the final package size of the LED is reduced, and the performance is more stable. Its "easy series" and flip-chip ceramic-based COB products (FCOB) adopt APT flip-chip soldering patent technology to realize gold-free and solid-free plastic package of single-chip and multi-chip modules, with high brightness and high light efficiency. High reliability, low thermal resistance, good color consistency and other characteristics. At present, Jingke Electronics has invested more in high-power and medium-power, with high-power capacity of about 10 KK/month; medium-power capacity of about 80 KK/month, and the end of the year is to expand to 100 KK/month, mainly for large-size TVs. Machine backlight and LED lighting market.
Packaging materials emphasize processing performance and high light transmission
In general, around the latest development of LED packaging technology, the following three aspects are generally proposed for packaging materials: good processing performance, ensuring higher production efficiency; assisting LED products to improve light efficiency; must be very stable and reliable. Taking the traditional plastic packaging material for LED packaging as an example, Wu Rui, application development and technical support manager of the Asia-Pacific region of the lighting industry of DSM Engineering Plastics Business Department, introduced the increasing reflectivity of materials in more and more customers. Increasingly stringent requirements are imposed on maintaining performance, and while these performances are being improved, costs must also be reduced. “For the cost of injection molding products, in addition to the material itself, the production cost is also very important. With the multi-cavity injection molding, it has become one of the mainstream choices of current processing plants, which also has the flowability and ease of processing performance materials. Processing performance puts higher requirements."
For this application, DSM has long been committed to the development of high thermal conductivity polymers for use in heat sinks and LED bulb housings, high reflection and yellowing resistant materials for optical components, and SMT resistant and yellowing resistant materials for LED modules. Group connectors and other aspects. For example, the company developed Stanyl For Tii LX, which is based on the latest PA4T substrate, has high temperature resistance (satisfying SMT process), high reflection and high mechanical strength. Compared with other types of materials, it has high initial reflectivity. And after reflow soldering, the reflectivity is better, which helps to improve the luminous efficiency of the LED light source; has better injection molding processing performance, can meet higher production efficiency and smaller product design requirements; has good resistance UV ability; less water absorption, excellent adhesion to silicone or epoxy sealant, can ensure long life of LED chips.
According to reports, DSM currently has a localized production plant in Jiangyin, Jiangsu. In order to enhance its R&D capabilities in Asia, the company also established a technology center in Shanghai in 2011 to provide localized innovation and quantity for Chinese customers. Customized technology application. In addition, CAE (Computer Aided Engineering) team in DSM Asia Pacific can provide LED manufacturers with CAE analysis including pre-machine/thermal stress/product flow, mid-term optical/mechanical/reflow soldering test, and late product potential failure. Analytical and other comprehensive technical service projects.
On the other hand, in the development of silicone, an important accessory for LED packaging, with the industry's higher pursuit of LED brightness, silicone materials with higher dismantling rates are also the first choice of manufacturers. Compared with methyl silicone (refractive index of 1.41), phenyl silicone has a relatively high refractive index (up to 1.54) and is receiving increasing attention from the market.
“Although the refractive indices of the two are only 0.12 apart, this small difference has a significant impact on the light output of the LED,†said Maruyama, Director of Global Industry, DOW CORNING Lighting Solutions, “even if it is identical. The chip, light box and input power, the LED potting material made of phenyl silicone has a light output rate that is 7% higher than that of the methyl silicone potting material. Before this, it would take a huge amount of time to significantly improve the performance of the LED chip. Investment; therefore, phenyl silicone potting materials offer a cost-competitive and simple alternative that significantly improves the LED's light output, luminous efficiency and value."
Phenyl silicone packaging materials also have the advantage of better thermal stability, making them widely used in many high-power general-purpose lighting products with 5~50W LED chip-on-board package structures. Compared to methyl-based technology, phenyl silicone packaging materials generally have stronger gas barrier properties, preventing the silver electrode from blackening due to moisture and corrosion. Since these electrodes also have a dual function as a light-reflecting element of the LED, improved gas barrier properties can better maintain the light output performance and reliability of the LED.
New manufacturing processes promote vertical integration of the industry
As a mid-stream of the industry chain, LED packaging is in a critical period of technological renewal. From a technical point of view, if traditional structures/processes continue to be used, the cost-effectiveness of the materials selected will be higher, so it is foreseeable that New packaging technologies, materials, manufacturing processes or both, will appear on the market. For example, recently there are unpackaged LED products introduced by Taiwanese manufacturers. It is understood that the new technology developed by combining the chip process and packaging process with the manufacture of light engines has the characteristics of better heat dissipation of flip-chips. In addition, it has the advantage of low cost. However, some manufacturers said that the technology is still in the evaluation stage. The main difficulty is that the coating of fluorescent materials can not be effectively controlled. Therefore, it is difficult to ensure the stability of light efficiency and light quality. It takes a while for mass production and use.
"LED packaging will develop toward high luminous efficiency, high reliability, high heat dissipation and thinning," Zhou Feng said. "The continuous development of chip technology makes the luminous efficiency of packaged products higher and higher, and new packaging technology. The packaging process will be widely used, such as eutectic technology, flip-chip process, new phosphor coating process, etc., while improving product process high reliability and high heat dissipation, it will further improve product luminous efficiency; high temperature resistance and resistance Materials such as UV and low water absorption, environmentally resistant, thermosetting materials such as EMC, thermoplastic PCT, modified PPA, and ceramic-like plastics will also be used in large quantities; the market will pay more attention to the light quality and low quality of packaged products. Cost, and the quality standards of LED products will continue to be improved and unified."
More importantly, along with the innovation of LED packaging technology and manufacturing process, the position of the packaging chain in the entire industrial chain will be promoted to the vertical direction. In this regard, Chen Haiying said that all technological advances will eventually meet the actual application needs of the market. Under the pressure of increasing the luminous efficiency per dollar (lm/$), the package of single-stand devices is required to be smaller. The highest luminous flux output is possible at the lowest cost. This requires LED packaging technology to learn more from the mature experience of IC packaging, such as EMC, SMC materials, etc. In this process, the industry division of labor will be constantly adjusted due to technological advancement, pure packaging will become more and more in the industry. It is difficult to exist as an independent industrial link, and new technological development will promote the integration of the industry in the vertical direction.
(This article is reproduced on the Internet. The texts and opinions expressed in this article have not been confirmed by this site, nor do they represent the position of Gaogong LED. Readers need to verify the relevant content by themselves.)
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