Semiconductor companies are racing to develop high-integration light-emitting diode (LED) lighting driver IC solutions. Under the tight production capacity of high-voltage metal oxide semiconductor field effect transistors (MOSFETs), LED lighting system vendors are facing the dilemma of delayed shipments, so chipmakers are stepping up to announce LED lighting driver IC solutions that integrate high-voltage MOSFETs to allow LED lighting System customers are free from the shortage of high-voltage MOSFETs.
NXP ’s regional marketing director Wang Yongbin said that both dimmed and non-dimmed LED driver ICs and resonant controllers of LED lamps require high-voltage MOSFETs, so NXP will ensure that customers have a good grasp of the supply through highly integrated LED driver IC solutions.
NXP Regional Marketing Director Wang Yongbin said that the LED lighting market will grow more vigorously in 2013, but the current LED lighting system developers are caught in the predicament of having many orders but unable to ship because of the serious shortage of high-voltage MOSFETs. Make a big punch in the market.
In order to avoid insufficient supply of high-voltage MOSFETs to affect the market expansion progress, chip manufacturers including NXP, STMicroelectronics (ST), Bauer Inte (PI), etc. have launched LED lighting driver IC solutions that integrate high-voltage MOSFETs. To ensure that customers' LED lighting products are shipped without any risk, and at the same time take the opportunity to expand in the LED lighting driver IC market.
NXP's Greater China Lighting Product Marketing Manager Zhang Weichao pointed out that in order to produce LED lighting driver ICs that integrate high-voltage MOSFETs, a high-voltage process is required. However, due to the high threshold of high-voltage process technology, not all chip manufacturers have the ability to develop, so it is expected Under this wave of out-of-stocks, there may be a trend that LED lighting driver IC suppliers will grow and decline.
In order to insert a flag into the market of highly integrated LED driver IC solutions, Wang Yongbin emphasized that NXP has converted the high-voltage SOI-HV process to the ABCD3 process that is more suitable for LED lighting applications. It is expected to start mass production in 2013. It is suitable for integrating high-voltage MOSFET, and can reduce leakage current, while eliminating unnecessary functions of LED lighting applications, energy output LED driver IC products with higher cost performance.
In addition to strengthening the high-voltage process technology, since only a few high-voltage MOSFET manufacturers such as STMicroelectronics, Toshiba, and Infineon are available at this stage, NXP has also done to ensure the smooth development of high-integration solutions Good preparation.
Zhang Weichao revealed that NXP estimates that the LED lighting market will expand rapidly in the second half of 2012, so it has already purchased products from high-voltage MOSFET manufacturers early, and today can ensure that customers can obtain highly integrated LED lighting driver IC solutions within six to eight weeks In the future, it will be shortened to three to four weeks to pick up the goods. In addition, NXP also has plans to invest in high-voltage MOSFET manufacturers to master a more stable supply.
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