Global Semiconductor Industry Spokesperson Global Semiconductor Alliance (GSA) has announced that it will raise the awareness and visibility of 3D IC technology and related education programs globally.
The GSA paid a high salary to the semiconductor industry's senior expert, Herb Reiter, who is the president of eda 2 asic Consulting, a longtime GSA leader, and a champion of the 3D IC initiative. The plan includes the establishment of a 3D IC work team led by Reiter. This team will bring together several key semiconductor companies and supply chain strengths, including EDA, packaging and OEM. In addition, GSA teamed up with IMEC, ITRI, SEMI, SEMATECH, and Si2 to jointly guide and participate in the program.
This year, GSA has published many academic reports on 3D ICs at various global industry shows, raising the awareness of 3D IC technology. At the 2010 European Conference on Design Automation and Testing (DATE) held in Dresden, GSA successfully held a 3D tutorial meeting that attracted more than 40 European system and IC designers and EDA representatives. During the DAC, the GSA 3D IC conference hosted approximately 100 participants. GSA also held other seminars and symposiums at the SemiCon West and GSA New Opportunities Exhibition. In addition, Reiter also wrote many reviews for the GSA Forum and "Future Fab" magazine, and was invited to publish an article on Yole Développement's November issue of "Micronews" on the comparison of 2.5 and 3D technologies. Reiter also participated in the review of the 3D expert team at the LSI Accelerated Innovation Conference held in early October and will present a wall poster at the 3rd International Conference on Integration of 3D Systems in Munich in November this year.
The GSA will further advance the program at the second GSA Memory Conference in San Jose on March 31, 2011. The theme for the 2011 session will be "Memory and Logic Integration and the Advantages of 3D IC Technology."
GSA President Jodi Shelton said, "The GSA realizes that the semiconductor industry is facing one of the biggest challenges that threaten the development of the entire industry - IC and system power loss is rapidly increasing. Our members are constantly reviewing the history of 2D SOC, and Exploring when and how to adopt a process to transition to a new paradigm to continue to meet the needs of our customers is why the GSA 3D IC Program is so focused on enhancing the customer's recognition of the benefits and importance of the technology."
To accelerate the development and promotion of high-capacity EDA tools and processes, GSA established an EDA interest team in May 2008 to analyze long-term market needs. Team members include EDA suppliers, semiconductor companies, manufacturers, and IC design services. Representatives of business, research institutions and other industry organizations. In addition, the team also provides advice on how EDA suppliers can work with customers and partners to fully meet these needs. In early 2009, the team decided to focus its research on tools and processes to support the rapidly emerging 3D IC technology. As a first step, they designed a brief survey questionnaire designed to fully understand the industry's plans to use the technology and the need for tools and processes.
Reiter said: “The wireless industry is pushing 3D IC stack technology to make up for the lack of power and space limitations of mobile Internet devices. At the same time, users of networks, graphics and computer equipment need 3D IC technology to meet the next generation of bandwidth and performance requirements. Various system and IC designers plan to step up cooperation to integrate heterogeneous processing technologies into the 3D IC stack."
The GSA will continue to work with other organizations to promote the widespread use of the 3D IC ecosystem, harmonize standards and determine synergies to develop economies of scale. At present, there are already many leading semiconductor suppliers that have crossed the traditional 2D design technology and have promoted the important advantages of implementing 3D technology in the enterprise. The GSA hopes to help the industry quickly transition to 3D IC technology, make it suitable for a wide range of applications at low cost, and increase the return on investment of early adopters.
The GSA paid a high salary to the semiconductor industry's senior expert, Herb Reiter, who is the president of eda 2 asic Consulting, a longtime GSA leader, and a champion of the 3D IC initiative. The plan includes the establishment of a 3D IC work team led by Reiter. This team will bring together several key semiconductor companies and supply chain strengths, including EDA, packaging and OEM. In addition, GSA teamed up with IMEC, ITRI, SEMI, SEMATECH, and Si2 to jointly guide and participate in the program.
This year, GSA has published many academic reports on 3D ICs at various global industry shows, raising the awareness of 3D IC technology. At the 2010 European Conference on Design Automation and Testing (DATE) held in Dresden, GSA successfully held a 3D tutorial meeting that attracted more than 40 European system and IC designers and EDA representatives. During the DAC, the GSA 3D IC conference hosted approximately 100 participants. GSA also held other seminars and symposiums at the SemiCon West and GSA New Opportunities Exhibition. In addition, Reiter also wrote many reviews for the GSA Forum and "Future Fab" magazine, and was invited to publish an article on Yole Développement's November issue of "Micronews" on the comparison of 2.5 and 3D technologies. Reiter also participated in the review of the 3D expert team at the LSI Accelerated Innovation Conference held in early October and will present a wall poster at the 3rd International Conference on Integration of 3D Systems in Munich in November this year.
The GSA will further advance the program at the second GSA Memory Conference in San Jose on March 31, 2011. The theme for the 2011 session will be "Memory and Logic Integration and the Advantages of 3D IC Technology."
GSA President Jodi Shelton said, "The GSA realizes that the semiconductor industry is facing one of the biggest challenges that threaten the development of the entire industry - IC and system power loss is rapidly increasing. Our members are constantly reviewing the history of 2D SOC, and Exploring when and how to adopt a process to transition to a new paradigm to continue to meet the needs of our customers is why the GSA 3D IC Program is so focused on enhancing the customer's recognition of the benefits and importance of the technology."
To accelerate the development and promotion of high-capacity EDA tools and processes, GSA established an EDA interest team in May 2008 to analyze long-term market needs. Team members include EDA suppliers, semiconductor companies, manufacturers, and IC design services. Representatives of business, research institutions and other industry organizations. In addition, the team also provides advice on how EDA suppliers can work with customers and partners to fully meet these needs. In early 2009, the team decided to focus its research on tools and processes to support the rapidly emerging 3D IC technology. As a first step, they designed a brief survey questionnaire designed to fully understand the industry's plans to use the technology and the need for tools and processes.
Reiter said: “The wireless industry is pushing 3D IC stack technology to make up for the lack of power and space limitations of mobile Internet devices. At the same time, users of networks, graphics and computer equipment need 3D IC technology to meet the next generation of bandwidth and performance requirements. Various system and IC designers plan to step up cooperation to integrate heterogeneous processing technologies into the 3D IC stack."
The GSA will continue to work with other organizations to promote the widespread use of the 3D IC ecosystem, harmonize standards and determine synergies to develop economies of scale. At present, there are already many leading semiconductor suppliers that have crossed the traditional 2D design technology and have promoted the important advantages of implementing 3D technology in the enterprise. The GSA hopes to help the industry quickly transition to 3D IC technology, make it suitable for a wide range of applications at low cost, and increase the return on investment of early adopters.
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