The article tells you why the chip is so hard to create

[Which article tells you why the chip is so difficult to create] As we all know, in every smart device, the chip has played a vital role, whether it is a PC, smart phone or smart wearable device, CUP is essential as a core component The presence. However, with such a small thing, China cannot currently mass-produce it effectively.

Sometimes an object is too subtle, does not mean that it is easy to manufacture, not to mention chips that need nano-technology to manipulate things, it is beyond human capabilities. In the IC chip, the most important thing is the transistor, which is equivalent to the nervous system in the human brain. The more transistors there are, the faster the chip will operate. Therefore, how to place more transistors in such a narrow place becomes a difficult problem.

The basic unit of the chip - transistor

The so-called transistor is a semiconductor device commonly used amplifier or electronic control switch. Due to its high speed and accuracy, it can be used for a variety of digital and analog functions, including amplification, switching, voltage regulation, signal modulation, and oscillators. Transistors can be packaged individually or in a very small area that can hold a part of 100 million or more transistor integrated circuits, which is why the number of transistors in the CPU can be integrated.

As early as 1929, the then engineer Lelifeld had patented a transistor. However, due to the technical level of the year, transistors could not be manufactured. Until December 1947, the earliest practical semiconductor devices in the world were manufactured in the Bell Labs. At the first test, this transistor was able to amplify the audio signal and its appearance was similar to a matchstick.

By 1950, the first “PN junction transistor” (PN junction is the junction of P-type and N-type, P-type multi-holes, N-type multi-electrons, which will be mentioned below) finally came out, and now the transistor Most of them still belong to this type of pn junction transistor.

The process of manufacturing chips

Back to chip production, what is a good chip production process now? As the brains of these smart devices, what steps do they need to go through?

The chip is actually a component carrying an integrated circuit, which can be roughly divided into two types. One is a functional chip such as a processing chip of a CPU or a communication base station, and the second type is a memory chip such as a flash memory in a computer.

To make a chip, the industry is mainly divided into such a few content. The first is the design of the chip, just as it is necessary to have a blueprint for a project. The same is true for a chip. What kind of functionality the chip is designed to achieve is determined at the design stage. This requires professionals to design the circuit. .

Followed by production, this step is also the most tedious, will be described in detail later. And finally, the packaging, that is, the packaging of the finished product into a product that can be sold, that is what we see in the market, this process is called packaging, most of the chip industry in China is involved Is the packaging industry.

In these three steps, the hardest thing is design, and it is easy to encapsulate. As the soul of the chip, without a good design, the chip can not be at all, so the design is very important.

Nowadays, China's chip industry is mainly concentrated in production and packaging, especially packaging, and there are few companies involved in designing. Even if a chip is designed, it is mainly focused on the low-end level, and the share of high-end chip design is basically zero.

The principle of chip operation

The main raw material for the production of chips is silicon, which is usually extracted from sand and gravel. The silica in the sand is melted and then reduced, and silicon is finally obtained. Doping is then performed on the elemental silicon. Boron is doped on the left side and phosphorus is on the right side.

The main reason for doping is due to the fact that the silicon element itself is not conductive, while the silicon element has four electrons around it, which is equivalent to four holes. The boron element has only three electrons around it. Compared to silicon, it lacks one electron, so the hole is the hole. Conductive is mainly called P-type semiconductor. Phosphorus is surrounded by five electrons, one more than silicon, and is called an N-type semiconductor. The combination of the two also becomes the above PN junction.

The main feature of the PN junction is that only the right side plus the positive side plus the negative current can pass. If the current direction is turned off, the current does not flow. This is the diode. In doing so, we can make many operations through these diodes that can only conduct one-way current flow, such as the NOR gate, etc. This knowledge is also mentioned in the high school curriculum and will not be repeated here.

How to make a chip?

Returning to the specific production of the chip, after silicon monoliths are produced, they are sliced ​​and cut into individual discs. Then, a photoresist is applied on the disks, and then these photoresist-coated wafers are lithographically etched by a lens through ultraviolet rays. After irradiation of photoresists at specific positions according to drawings in the design, the lithography is performed. The glue will also change accordingly.

After the photolithography, the etching is performed. Because of the design, the etching area is also different. In the case of a general production, the area after the photolithography is etched, and the area without the photolithography is not. Of course, the situation may be reversed. All are based on actual needs.

For example, the etched area is etched. For example, grooves are formed in the etched area, and doping is performed in these grooves, that is, the above-mentioned boron element or phosphorus element. Finally, the photoresist is washed away by scrubbing, leaving only the silicon wafer after doping. At this time, the semiconductor PN junction can be produced.

Such steps may be more than one time. If complex functions need to be realized, steps such as gluing, doping, etching, and cleaning need to be repeated, and then metal is deposited thereon for circuit connection. Finally, a complete wafer is produced. After the wafer is diced, the package becomes a chip. This is a complete chip production process.

The reason for the scarcity of chip design

From the industrial structure point of view, China's chip industry is particularly scarce in the design field, the main reason is that there are three points. The first is the issue of education and environment. Due to the foreign technology blockade and the scarcity of talents in the domestic chip industry, education is always lacking and the world’s most advanced chip design thinking cannot be touched. Naturally, a good talent cannot be cultivated.

The second is not paying enough attention to technical talents, or saying that the entire industry is too indifferent to technical talents, resulting in many technology-oriented talents being diverted from hardware to software development or sales. This has also led to the inability of China's chip talent gap to be filled.

The third is that the entire market is full of foreign high-end chips. Therefore, in many cases domestic chips cannot get effective feedback from the market. This has led to a very slow pace of update, which naturally drags down the pace of domestic chip development.

Of course, there are many countermeasures to solve this situation. For the first question, China already has

The National Thousand Talents Program extradites high-tech talent from abroad to lead the domestic technology industry to further development.

Regarding the second issue, we still need to change the concept of domestic entrepreneurs. When the treatment of technicians can become the top position in the company, these technical talents will naturally return.

Regarding the last question, since the US sanctions against ZTE have eased, the impact of this matter has already threatened all domestic technology companies, and it has welcomed new business opportunities for the domestic chip industry, at least for The domestic chip is a place to test water, allowing it to update iteratively.

summary

China's chip industry has been stumbled all the way. After the “Hanshin” incident, it suffered a heavy blow. Now everything is in a state of unfinished business. Plus the opportune time created by the United States, it is the flourishing development of China’s chip industry. The key opportunity is to believe that China's chip industry can return to glory.

Different from the enterprise, if the country wants to achieve a great renaissance, it will inevitably have to master its own core technologies in every industry, but it can not be the first, but it can not be without, and the rise of this chip field, coupled with the country's boost, believe It will have a far-reaching impact on the future semiconductor industry.

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