The semiconductor industry is a technology that originated abroad, and many related technical terms are expressed in English. And because many practitioners have overseas experience, or they are accustomed to expressing related process and technology nodes in English, it causes many English terms to be translated into Chinese, and many people cannot compare them or don't know how to translate. Here we have compiled the Chinese and English versions of some commonly used semiconductor terms, and hope to help you. If there is an error, please help to correct it, thank you!
Common semiconductor Chinese-English comparison table
Ion implanter
LSS theory Lindhand Scharff and Schiott theory, also known as "Linhand Scharff and Schiott theory".
Channeling effect
Range distribution
Depth distribution
Projected range
Stopping distance
Stopping power
Standard stopping cross section
Annealing
Activation energy
Isothermal annealing
Laser annealing
Stress-induced defect
Preferred orientation
Mask-making technology
Pattern distortion
First minification
Final minification
Master mask
Chromium plate
Dry plate
Emulsion plate
See-through plate
High resolution plate, HRP
Plate for ultra-microminiaturization
Mask
Mask alignment
Alignment precision
Photoresist photoresist, also known as "photoresist".
Negative photoresist
Positive photoresist
Inorganic resist
Multilevel resist
Electron beam resist
X-ray resist
Scrubbing
Spinning
Photoresist coating
Postbaking
Photolithography
X-ray lithography
Electron beam lithography
Ion beam lithography
Deep-UV lithography
Lithography machine mask aligner
Projection mask aligner
Exposure
Contact exposure method
Proximity exposure method
Optical projection exposure method
Electron beam exposure system
Step-and-repeat system
Development
Linewidth
Stripping of photoresist
Removing of photoresist by oxidation
Removing of photoresist by plasma
Etching
Dry etching
Reactive ion etching, RIE
Isotropic etching
Anisotropic etching
Reactive sputter etching
Ion beam milling is also called "ion milling".
Plasma etching
Undercutting
Lift-off technology, also known as "floating off technology".
Endpoint monitoring
Metallization
Interconnection
Multilevel metallization
Electromigration
Reflow
Phosphorusilicate glass
Boron-phosphorosilicate glass
Passivation technology
Multilayer dielectric passivation
Scribing
Electron beam slicing
Sintering
Indentation
Thermocompression bonding
Thermosonic bonding
Cold welding
Spot welding
Ball bonding
Wedge bonding
Inner lead bonding
Outer lead bonding
Beam lead
Mounting technology
Adhesion
Packaging
Metallic packaging
Ceramic packaging
Flat packaging
Plastic package
Glass packaging
Micropackaging, also known as "micro-assembly".
Shell package
Die
Lead bonding
Lead frame bonding
Tape automated bonding, TAB
Laser bonding
Ultrasonic bonding
Infrared bonding
A collection of microelectronic dictionaries
(In alphabetical order)
A
Abrupt junction Accelerated testing Accelerated testing Acceptor Acceptor atom Accumulation Accumulation Accumulating contact Accumulating contact
Accumulation region Accumulation layer Accumulation layer Active region Active component Active device Active device Activation
Activation energy Active region Admittance Admittance Allowed band Allowed band Alloy-junction device
Aluminum(Aluminium)
Aluminum-oxide Aluminum passivation Aluminum passivation Ambipolar Bipolar Ambient temperature Amorphous Amorphous, non-crystalline Amplifier Power amplifier Amplifier Amplifier Analogue (Analog) comparator Analog comparator
Angstrom
Anneal Anisotropic Anisotropic Anode Arsenic (AS) Arsenic (AS) Arsenic Auger Auger process Auger process Avalanche Avalanche breakdown Avalanche excitation Avalanche excitation
B
Background carrier Background doping Background doping Backward Reverse Backward bias Reverse bias Ballasting resistor Rectifier resistor
Ball bond Band Band gap Band gap Barrier barrier Barrier layer Barrier width Barrier width
Base Base contact Base stretching Base transit time Base transport efficiency Base-width modulation Base-width modulation
Basis vector Bias Bilateral switch Binary code Binary compound semiconductor Binary compound semiconductor Bipolar Bipolar Junction Transistor (BJT) bipolar transistor
Bloch Blocking band Blocking contact Blocking contact Body-centered Body-centred cubic structure Body-centred cubic structure
Boltzmann Boltzmann Bond bond, Bonding electron Bonding pad Bonding point Bootstrap circuit Bootstrap circuit
Bootstrapped emitter follower Bootstrapped emitter follower
Boron Borosilicate glass Boundary condition Bound electron Bound electron Breadboard Simulation board, test board Break down Break down Break over Brillouin Brillouin zone Brillouin zone Built-in Built-in electric field in the built-in electric field Build an electric field
Bulk body/body
Bulk absorption
Bulk generation Bulk recombination Bulk recombination Burn-in Burn out Burn out Buried channel Buried diffusion region Buried diffusion region
C
Can Shell Capacitance Capacitance Capacitance Capture cross section Capture cross section Capture carrier Capture carrier Carrier Carrier, carrier Carry bit Carry-in bit Carry-in bit Carry-out bit Carry-out bit
Cascade Cascade Cascade Cascade Cathode Cathode Center Ceramic Channel Channel
Channel breakdown
Channel current Channel doping Channel shortening Channel shortening Channel width Channel width Characteristic impedance Charge-compensation effects Charge-compensation effects
Charge conservation Charge neutrality condition Charge drive/exchange/sharing/transfer/storage Charge drive/exchange/sharing/transfer/storage Chemical etching Chemical etching Chemically-Polish Chemically-Mechanically Polish (CMP) Chemical machinery polishing
Chip Chip yield Chip yield Clamped Clamping diode Cleavage plane Cleavage plane Clock rate Clock generator Clock generator Clock flip-flop Close-packed structure Close-packed structure
Close-loop gain Collector Collector Collision Collision Compensated OP-AMP Compensated OP-AMP Common-base/collector/emitter connection Common-gate/drain/source connection Common-gate/drain/source connection Common-gate/drain/source connection connection
Common-mode gain Common-mode input Common-mode input Common-mode rejection ratio (CMRR) Common-mode rejection ratio (CMRR)
Compatibility Compensation Compensated impurities
Compensated semiconductor Complementary Darlington circuit Complementary Metal-Oxide-Semiconductor Field-Effect-Transistor (CMOS) Complementary Darlington circuit
Complementary error function Computer-aided design (CAD)/test(CAT)/manufacture(CAM) Computer-aided design (CAD)/test(CAT)/manufacture(CAM) Compound Semiconductor
Conductance Conductance Conduction band (edge) Conduction band (bottom) Conductor level/state Conductor Conductivity Conductivity Configuration Configuration Conlomb Coulomb Conducted Configuration Devices Structure configuration
Constants Physical constant Constant energy surface Constant-source diffusion Constant-source diffusion Contact Contact Contamination Pollution control Continuity equation
Contact hole Contact potential Contact potential Continuity condition Contra doping Anti-doping Controlled Controlled Converter Conveyer Transmitter Copper interconnection system Copper interconnection system
Couping Covalent Covalent Crossover Crossover Crossover Critical Crossunder Crossover Crucible crucible Crystal defect/face/orientation/lattice Crystal defect/face/orientation/lattice Crystal defect/face/orientation/lattice
Current density Curvature Curvature Cut off Current drift/dirve/sharing Current drift/dirve/sharing Current drift/drive/sharing Current Sense Current sampling Curvature bending Custom integrated circuit Custom integrated circuit Cylindrical cylindrical Czochralshicrystal Vertical single crystal Czochralski technique ( Cz method Czochralski crystal J)
D
Dangling bonds Dark current Dark current Dead time Dead time Debye length De.broglie Decderate Decibel (dB) Decode Decode
Deep acceptor level Deep donor level Deep donor level Deep impurity level Deep trap Deep trap Defeat Degenerate semiconductor Degenerate semiconductor
Degeneracy Degradation Degree Celsius(centigrade) /Kelvin Celsius/Kelvin
Delay Density of states Density of states Depletion depletion approximation Depletion approximation
Depletion contact Depletion depth Depletion effect Depletion effect Depletion layer Depletion MOS Depletion MOS Depletion region Depletion region Deposited film Deposited film Deposition process Deposition process Design rules Design rules Die chip (plural dice)
Diode Diode Dielectric Dielectric isolation Dielectric isolation Difference-mode input Differential amplifier Differential capacitance Differential capacitance
Diffused junction Diffusion Diffusion coefficient Diffusion constant Diffusion constant Diffusivity Diffusion capacitance/barrier/current/furnace Diffusion capacitance/barrier/current/furnace
Digital circuit Dipole domain Dipole layer Dipole layer Direct-coupling Direct-gap semiconductor Direct-gap semiconductor
Direct transition Discharge Discrete component Dissipation Dissipation Distribution Distributed capacitance Distributed model Displacement Displacement
Dislocation
Domain Domain Donor Donor Donor exhaustion Donor exhaustion Dopant dopant Doped semiconductor Doping concentration Doping concentration Double-diffusive MOS (DMOS) Double-diffusive MOS (DMOS).
Drift
Drift field Drift mobility Mobility Dry etching Dry/wet oxidation Dry/wet oxidation Dose Duty cycle Duty cycle Dual-in-line package (DIP) Dual-in-line package (DIP)
Dynamics Dynamic characteristics Dynamic impedance Dynamic impedance
E
Early effect Early failure Effective mass Einstein relation (ship) Einstein relation Electric Erase Programmable Read Only Memory (E2PROM) One-time Erasable Read Only Memory (E2PROM)
Electrode Electrominggratim Electromigration Electron affinity Electron affinity Electronic -grade Electron-beam photo-resist exposure Photoresist electron beam exposure
Electron gas Electron-grade water Electron-grade water Electron trapping center Electron Volt (eV) Electron Volt (eV) Electrostatic Element element/component/accessory Elemental semiconductor Elemental semiconductor
Ellipse Ellipsoid Ellipsoid Emitter Emitter Emitter-coupled logic Emitter-coupled pair Emitter-coupled pair Emitter follower Emitter follower Empty band Emitter crowding effect Emitter crowding effect Endurance test = life test Life test test
Energy state Energy momentum diagram Energy-momentum (EK) diagram Enhancement mode Enhancement mode Enhancement MOS Enhanced MOS Entefic (low) eutectic Environmental test Environmental test
Epitaxial epitaxial layer Epitaxial slice Epitaxial slice Expitaxy Epitaxial Equivalent curcuit equivalent circuit
Equilibrium majority/minority carriers Equilibrium majority/minority carriers Erasable Programmable ROM (EPROM) can access (program) memory Error function complement
Etch Etchant Etchant Etching mask Resist mask Excess carrier Excitation energy Excitation energy Excited state Exciton Exciton Extrapolation Extrapolation Extrinsic Extrinsic semiconductor Impurity semiconductor
F
Face-centered Face-centered Cube Fall time Fan-in Fan-out Fan-out Fast recovery Fast surface states Feedback Feedback Fermi level Fermi-Dirac Distribution Fermi-Dirac Distribution
Femi potential Fick equation Fick equation (diffusion) Field effect transistor Field oxide Field oxide Filled band Full band
Film Thin film Flash memory Flat band Flat pack Flat pack Flicker noise Flip-flop toggle Flip-flop toggle
Floating gate Fluoride etch Hydrogen fluoride etching Forbidden band Forbidden band Forward bias Forward bias
Forward blocking /conducting Forward blocking/conducting
Frequency deviation noise Frequency response Frequency response Function function
G
Gain
Gallium-Arsenide(GaAs) Potassium arsenide Gamy ray r Ray Gate, gate, gate oxide Gate oxide Gauss(ian) Gaussian distribution profile Gaussian distribution profile Generation-recombination generation-recombination
Geometries Germanium(Ge) Germanium Graded Graded (gradual) channel Graded (gradual) channel
Graded junction Grain Gradient Gradient Grown junction Growth junction Guard ring Gummel-Poom model Gunn-effect Dirichlet effect
H
Hardened device Radiation hardened device
Heat of formation Heat sink Heat sink Heavy/light hole band Heavy/light hole band
Heterojunction Heterojunction structure Heterojunction Bipolar Transistor (HBT) Heterojunction Bipolar Transistor (HBT) Heterojunction Heterojunction structure
High field property High-performance MOS. (H-MOS) High-performance MOS. Hormalized Normalized Horizontal epitaxial reactor Horizontal epitaxial reactor
Hot carriorHybrid integrationHybrid integration
I
Image-force Impact ionization Impact ionization Impedance Impedance Impedance structure Implantation dose Implantation dose Implanted ion Implanted ion
Impurity Impurity scattering Magazine scattering Incremental resistance (differential resistance)
In-contact mask Indium tin oxide (ITO) Induced channel Induced channel
Infrared Infrared Injection Input offset voltage Input offset voltage Insulator Insulated Gate FET (IGFET) Insulated gate FET
Integrated injection logic
Integration and integration Interconnection Interconnection time delay Interdigitated structure
Interface Interference Interference International system of unions
Internally scattering Interpolation Intrinsic Intrinsic semiconductor Inverse operation Inverse operation
Inversion Inverter Inverter Ion Ion beam Ion etching Ion etching Ion implantation Ionization Ionization energy Ionization energy Irradiation Irradiation Isolation land Isolation island Isotropic Isotropic
J
Junction FET(JFET) Junction isolation Junction spacing Junction side-wall Junction side-wall
L
Latch up Lattice Lattice Layout of Lateral Lateral Lattice binding/cell/constant/defect/distortion Lattice binding/cell/constant/defect/distortion Lattice binding/cell/lattice/lattice Changshu/lattice defect/lattice distortion
Leakage current Level shifting Level shifting Life time Linearity Linearity Linked bond Covalent bond Liquid Nitrogen Liquid-phase epitaxial growth technique Liquid-phase epitaxial growth technique
Lithography Light Emitting Diode (LED) Light Emitting Diode (LED) Load line or Variable Load line Locating and Wiring Placement and Wiring Longitudinal Vertical Logic swing Lorentz Lumped model Lumped model
M
Majority carrier Majority carrier Mask mask, lithography mask level Mask set Mask set Mass-action law Master-slave D flip-flop Master-slave D flip-flop
Matching Matching Maxwell Maxwell Mean free path Mean free path Meandered emitter junction Mean time before failure (MTBF) Mean working time
Megeto-resistance Mesa Mesa MESFET-Metal Semiconductor FET Metallization Microelectronic technique Microelectronics Microelectronics Millen indices Minority carrier Minority carrier
Misfit Mismatching Mismatching Mobile ions Mobility Mobility Module Module Modulate Molecular crystal Molecular crystal Monolithic IC Monolithic IC
MOSFET metal oxide semiconductor field effect transistor
Mos. Transistor (MOST) MOS. Transistor Multiplication Modulator Modulation Multi-chip IC Multi-chip IC Multi-chip module (MCM) Multi-chip module Multiplication coefficient Multiplication factor
N
Naked chip Negative feedback Negative resistance Negative resistance Nesting Negative-temperature-coefficient Negative-temperature-coefficient Negative-temperature-coefficient Noise margin Noise margin Nonequilibrium Non-balance Nonrolatile Non-volatile (volatile) Normally off/on Close/Open Numerical analysis
O
Occupied band Full Band Officienay Power Offset, Offset On standby Standby state Ohmic contact Open circuit Open circuit Operating point Operating point Operating bias Operating bias Operating amplifier (OPAMP)
Optical photon =photon Optical photon =photon Optical quenching Optical transition Optical transition Optical-coupled isolator Optical-coupled isolator Organic semiconductor Organic semiconductor Orientation Crystal orientation, orientation
Outline Out-of-contact mask Non-contact mask Output characteristic Output voltage swing Output voltage swing Overcompensation Over-current protection Over shoot Over-voltage protection Over-voltage protection
Overlap Overload Overload Oscillator Oscillator Oxide Oxidation Oxide passivation Oxide passivation
P
Package Package Pad Bonding point Parameter Parasitic effect Parasitic effect Parasitic oscillation Parasitic oscillation Passination Passive Passive component Passive component
Passive device Passive surface Passive interface Parasitic transistor Parasitic transistor Peak-point voltage Peak voltage Peak voltage Permanent-storage circuit Permanent-storage circuit
Period Periodic table Permeable-base Permeable base area Phase-lock loop Phase-locked loop Phase drift Phase shift Phonon spectra Photo conduction Photoconductivity
Photo diode Photoelectric cell Photoelectric effect Photoenic devices Photonic devices Photolithographic process (photo) resist (photosensitive) anti-corrosion agent
Pin pin Pinch off Pinning of Fermi level Pinning of Fermi level (effect) Planar process Planar transistor Planar transistor
Plasma Plasma Plezoelectric effect Piezoelectric effect Poisson equation Poisson equation Point contact Polarity Polarity Polycrystal Polycrystalline Polymer semiconductor
Poly-silicon Polysilicon Potential (electric) Potential barrier Potential well Potential well Power dissipation Power consumption Power transistor Power transistor Preamplifier Preamplifier Primary flat Principal axes Spindle Print-circuit board (PCB) Printed circuit board
Probability Probability Probe Probe Process Process Propagation delay Pseudopotential method Pseudopotential method
Punch through Pulse triggering/modulating
Pulse Widen Modulator (PWM)
Punchthrough Push-pull stage Push-pull stage
Q
Quality factor Quantization Quantum Quantum Quantum efficiency Quantum mechanics Quantum mechanics Quasi – Fermi-level Quartz Quartz
R
Radiation conductivity
Radiation damage Radiation flux density Radiation hardening Radiation hardening Radiation protection Radiation-recombination
Radioactive Reach through Reactive sputtering source
Read diode Recombination composite Recovery diode Reciprocal lattice Reciprocal lattice Recovery time Recovery time Rectifier Rectifying contact Rectifying contact Reference Reference point Reference point Refractive index Refractive index
Register Register Registration align with Regulate control to adjust Relaxation lifetime relaxation time
Reliability Resonance Resonance Resistance Resistance Resistor Resistivity Resistivity Regulator Voltage regulator tube (device)
Relaxation Resonant frequency Response time Response time Reverse Reverse bias Reverse bias
S
Sampling circuit Sapphire Sapphire (Al2O3) Satellite valley Saturated current range
Saturation region Saturation Saturation Scaled down Scaled down Scattering Scattering Schockley diode Schottky Schottky barrier Schottky contact Schottky contact
Schrodingen Scribing grid Secondary flat Seed crystal Segregation Segregation Selectivity Selectivity Self aligned Self-aligned Self diffusion Self-diffusion Semiconductor Semiconductor-controlled rectifier SCR
Sendsitivity Sensitivity Serial/series Series inductance Settle time Settle time Sheet resistance Shield Shielding Short circuit Short circuit Shot noise Shot noise
Shunt Sidewall capacitance
Signal Silica glass Silicon Silicon carbide Silicon dioxide (SiO2) Silicon Nitride(Si3N4) Silicon On Insulator Silicon On Insulator
Siliver whiskers Simple cubic Single crystal Single crystal Sink Shen Skin effect Skin effect Snap time Sneak path Sulethreshold Subthreshold Solar battery/cell Solar battery
Solid circuit Solid circuit Solid Solubility Solid solubility Sonband subband Source Source follower Source follower Space charge Specific heat (PT) Speed-power product Speed-power product
Spherical
Spin Spin Split Spontaneous emission Spreading resistance Sputtering
Stacking fault Static characteristic Stimulated emission Stimulated recombination Stimulated recombination Stimulated recombination Storage time Storage time
Stress Stress Straggle Deviation Sublimation Sublimation Substrate Substitutional Substitution Superlattice Superlattice Supply Power
Surface Surge capacity Surge capacity Subscript Subscript Switching time Switching time Switch
T
Tailing Extension Terminal Tensor Tensor Thermal activation of Tensorial tensor Thermal activation Thermal conductivity Thermal conductivity Thermal equilibrium Thermal equilibrium Thermal Oxidation Thermal oxidation Thermal resistance Thermal resistance
Thermal sink Thermal velocity Thermal motion Thermoelectricpovoer Thermoelectricpovoer Thick-film technique Thick-film technology Thin-film hybrid IC Thin-Film Transistor (TFT) Thin-Film Transistor (TFT)
Threshlod Threshold Thyistor Transconductance Transconductance Transfer characteristic Transfer electron Transfer function Transfer function
Transient Transistor aging(stress) Transit time Transit time
Transition Transition-metal silica Transition-metal silica Transition probability Transition probability Transition region Transition Transition Transverse Trapped Trapping Trapped charge Triangle generator Triangle generator
Triboelectricity Triboelectricity Trigger Trigger Trim deployment adjustment Triple diffusion Truth table Truth table Tolerahce Tolerance Tunnel(ing) Tunnel (through) Tunnel current Turn over Turn over Turn-off time Turn off time
U
Ultraviolet Ultraviolet Unijunction Unipolar Unipolar Unit cell Original (unit) cell Unity-gain frequency Unilateral-switch unilateral switch
V
Vacancy Vacancy
Vacuum Valence(value) band
Value band edge Valence bond Valence bond
Vapour phase Vapor phase Varactor
Varistor Vibration Vibration
Voltage
W
Wafer chip Wave equation Wave guide Wave-particle duality Wave-particle duality Wave-particle duality Wave-particle duality Wear-out Burnout Wire routing Wiring Work function Work function Worst-case device Worst-case device
Y
Yield yield
Z
Zener breakdown Zone melting
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