Although in the past we knew that HTC and Lenovo would bring Google's Daydream platform VR all-in-one to the market, we do not know more detailed product information. Now, VR Playnet understands that both VRs are manufactured with Qualcomm's VRDK reference design.
The Google Daydream prototype VR all-in-one that was shown at the Google I/O conference in May was based on older hardware, probably based on the old VRDK of the Qualcomm Snapdragon 820 chip. Qualcomm now said that HTC and Lenovo's VR-based machine will be built around the latest version of VRDK, using a more powerful Snapdragon 835 chip.
Not long ago, Qualcomm released some of the component details of the latest VRDK: Ximmerse built a high-precision, drift-free, low-latency 3DoF controller for VR applications; Bosch Sensortec has a BMX055 absolute directional sensor, and the sensor components include accelerometers, gyroscopes, and Magnetometers that provide "accurate and high-frequency inertial measurements" mean more accurate and lower-latency motion tracking; OmniVision integrates the OV9282, which is a 1MP high-speed shutter image sensor that can be used for feature tracking and can be used at 120Hz Capture 1280 x 800 resolution images, or capture 640 x 480 resolution images at 180Hz.
It is expected that HTC and Lenovo's Daydream will be equipped with 90Hz, 2560 x 1440 resolution AMOLED display.
The outer layer of double wall heat shrinkable casing is made of high quality polyolefin alloy and the inner layer is made of hot melt adhesive. After molding, the product is crosslinked and continuously expanded by electron accelerator irradiation.
The outer layer has the advantages of softness, low temperature shrinkage, insulation, anti-corrosion and wear resistance, while the inner layer has the advantages of low melting point, good adhesion, waterproof sealing and mechanical strain buffering.
Widely used in electronic equipment wiring waterproof, leakproof, multi-strand wire harness sealing waterproof (such as home appliance wiring harness, automotive wiring harness, etc.), wire and cable branch sealing waterproof, metal pipeline corrosion protection, wire and cable repair, water pump and submersible pump wiring waterproof and other occasions.
Double wall heat shrinkable casing is produced by double layer co-extrusion process of polyolefin halogen-free flame retardant material and hot melt adhesive.
The outer layer is polyolefin, which has the characteristics of insulation, halogen-free flame retardant and low temperature shrinkage. The inner layer of hot melt adhesive has the advantages of low melting point, good adhesion, waterproof sealing and mechanical strain buffer.
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