After the acquisition of the fluorescent film project of Nitto Denko by Zhongshan Stereo Optoelectronics, the battle for fluorescent film continued.
Recently, Degao Chemical and Nitto Denko signed an agreement to undertake the localization development and service of the second-generation Conformal Coating CSP.
The agreement with Nitto Denko involves 39 patent use rights, acquisition of some R&D and production equipment of Nitto LED Division, and 50um ultra-thin fluorescent film processing technology, including the use of Dow Corning special organic silicon material to make fluorescent thin film.
With the focus of Nitto Denko Group's market strategy on the pharmaceutical and health sectors, the Group's LED business unit announced that it will completely withdraw from domestic (Japan) and overseas markets in October this year.
In order to fulfill its corporate and market responsibilities, Nitto Denko transferred 400um thick fluorescent film technology and CSP method to four users in Zhongshan, Guangzhou, Foshan and Baoan, and promoted localization of 50um film technology with Deco Chemicals. Realization. Recently, Degao Chemical has received Nitto equipment and merged into the film production line under construction.
Compared with CSP packaging technology such as spraying, printing and Molding, the fluorescent film material based on B-Stage technology has the advantages of uniform and stable phosphor distribution, small curing shrinkage of encapsulation layer and high investment-output ratio of packaging equipment.
Degao Huacheng and Nitto Denko have been developing fluorescent film technology since 2012 at almost the same time. Deco's technical route is to mix silicone and phosphor to obtain a higher degree of B-Stage intermediate material by roll forming; Nitto Denko based on thixotropic powder mixing, lower B-Stage degree solidification film forming technology. The vacuum encapsulation equipment and the necessary fixtures are required for both materials to encapsulate the CSP.
The single-sided light-emitting CSP of the surrounding white wall is mostly used for the directional light source and the TV backlight. The white film and the fluorescent film are combined twice to achieve a low-cost single-sided light-emitting package. At present, Degao Chemical is actively improving the development of related materials, processes and equipment.
The current popular CSP1313 structure has an overall thickness of 350 μm and an encapsulation layer above the chip of 200 μm. This structure is rapidly recognized in the market for lighting applications such as smart dimming.
However, in the field of television backlighting, the structure is difficult to pass through a high current application of 600 mA or more, and an excessively thick adhesive layer causes a junction temperature rise or even a burst of glue.
In the field of flashlights, because the optical path of the vertical light and the oblique light passing through the fluorescent layer is different, a yellow halo phenomenon is caused, which affects the photographing effect.
If the fluorescent encapsulating material of the coated chip can be controlled at 50-100 um, the two problems can be solved in terms of heat dissipation and optical effect. Therefore, the development of the fluorescent film to thinning is an important step for the perfect structure of the CSP.
The conformal fit CSP includes several key technologies: silicone base material development, ultra-thin fluorescent film film formation, vacuum bonding equipment and fixtures. Degao Huacheng has deepened its cooperation with Dow Corning's materials on the existing technology platform of Nitto Denko, and continues to develop thin film manufacturing technology and CSP application technology.
2017 is the first year of the true meaning of LED CSP. Degao Huacheng is committed to deep-growing fluorescent film manufacturing technology, providing sophisticated CSP solutions for LED users such as smart dimming lighting, TV mobile phone backlight, mobile phone flash, Wafer Level vertical chip. Program.
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